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13715263164
13715263164
| 項目 | 批量 | 樣品 | |
| 層數(shù) | 2~68L |
120L |
|
| 最大(dà)闆厚 | 10mm（394mil） |
14mm（551mil） |
|
最小(xiǎo)線寬間(jiān)距 |
內(nèi)層 | 2.2mil/2.2mil |
2.0mil/2.0mil |
| 外層 | 2.5/2.5mil |
2.2/2.2mil |
|
| 對位能力 | 同張芯闆對位 |
±25um |
±20um |
層間(jiān)對位 |
±5mil |
±4mil |
|
最大(dà)銅厚 |
6Oz |
30Oz |
|
孔徑 |
機械鑽孔 |
≥0.15mm(6mil) |
≥0.1mm(4mil) |
| 激光鑽孔 | 0.1mm（4mil） |
0.050mm（2mil） |
|
最大(dà)尺寸 （完成尺寸） |
單闆 |
850mmX570mm |
1000mmX600mm |
背闆 |
1250mmX570mm |
1320mmX600mm |
|
厚徑比 （完成孔徑） |
單闆 |
20:1 |
28:1 |
| 背闆 | 25:1 |
35:1 |
|
材料 |
無鉛/無鹵 |
EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF |
|
高(gāo)速 |
Megtron6, Megtron4,Megtron7,TU872SLK,FR408HR,N4000-13 Series,MW4000,MW2000,TU933 |
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| 高(gāo)頻 | Ro3003, Ro3006, Ro4350B,Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 |
||
| 其他 | Polyimide, Tk, LCP, BT, C-ply,Fradflex, Omega , ZBC2000, |
||
| 表面處理(lǐ) | 噴錫，化學鎳金，化學錫，OSP，化學銀，金手指，電(diàn)鍍硬金/軟金，選擇性OSP，化學鎳钯金 |
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| 産品類型 | 參數(shù) | 2017 | 2018 | 2019 | ||||
| 批量 | 樣品 | 批量 | 樣品 | 批量 | 樣品 |
|||
| 背闆 | 層數(shù) | 68L | 100L | 68L | 100L | 68L | 120L | |
| 完成尺寸 | 1250mmX570mm |
1320mmX570mm |
1250mmX570mm | 1320mmX570mm | 1250mmX570mm | 1320mmX570mm | ||
| 厚度 | 10mm |
14mm | 10mm | 14mm | 10mm | 14mm | ||
厚徑比(完成孔徑) |
22:1 | 25:1 | 25:1 | 35:1 | 25:1 | 35:1 | ||
| 單闆 | 層數(shù) | 36 | 32 | 36 | 36 | 36 | 36 | |
| 外層線寬/間(jiān)距 | 3mil/3mil |
2.8mil/2.8mil |
3mil/3mil |
2.5mil/2.5mil | 3mil/3mil |
2.5mil/2.5mil | ||
| 內(nèi)層線寬/間(jiān)距 | 2.2mil/2.2mil |
2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | ||
| 厚徑比(完成孔徑) | 18:1 |
24:1 | 20:1 | 28:1 | 20:1 | 28:1 | ||
| 阻抗公差 | ±8% |
±5% | ±7% | ±5% | ±7% | ±5% | ||
| 厚銅 | 最大(dà)銅厚 | 6Oz |
30Oz | 6Oz | 30Oz | 6Oz | 30Oz | |
| HDI | 結構 | Any Layer(10L) |
Any Layer(12L) | Any Layer(10L) | Any Layer(14L) | Any Layer(10L) | Any Layer(16L) | |
| 外層線寬/間(jiān)距 | 2.5/2.5mil |
2.2/2.2mil | 2.2/2.2mil | 2.0/2.0mil | 2.0/2.0mil | 1.6/1.6mil | ||
| 盲孔厚徑比 | 1:1 |
1.2:1 | 1:1 | 1.2:1 | 1.2:1 | 1.2:1 | ||
| 射頻産品 | 微帶線精度 | 線寬 | ±0.8mil |
±0.8mil | ±0.8mil | ±0.5mil | ±0.8mil | ±0.5mil |
| 線長 | ±1.5mil |
±1.5mil | ±1.5mil | ±1.2mil | ±1.2mil | ±1mil | ||
| 金屬基 | 結構 | Post-bonding, Pre-bonding,Sweat-soldering, Conductive adhesive, Press-fit,Embedded Coin(I, T U) |
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| 剛撓産品 | 結構 | Book, Air-gap, Fly-tail,Unsymmetrical, Semi-flex |
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| 材料 | Polyimide, Halogen-free, Lead-free,LCP, Tk |
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| 特殊工藝 | POFV(VIPPO)，混壓，局部混壓，長短(duǎn)/分級/分段金手指，空(kōng)腔，台階槽，背鑽，側壁金屬化，N+N結構，雙面壓接機械盲孔，埋入式芯片/分立器(qì)件/平面電(diàn)容電(diàn)阻，局部厚銅，高(gāo)溫壓合，銅漿/銀漿塞孔，跳(tiào)孔 |
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